High Voltage Cascoded III-Nitride Rectifier Package

ABSTRACT

Some exemplary embodiments of high voltage cascoded III-nitride semiconductor package utilizing clips on a package support surface have been disclosed. One exemplary embodiment comprises a III-nitride transistor attached to a package support surface and having an anode of a diode stacked over a source of the III-nitride transistor, a first conductive clip coupled to a gate of the III-nitride transistor and the anode of the diode, and a second conductive clip coupled to a drain of the III-nitride transistor. The conductive clips are connected to the package support surface and expose respective flat portions that are surface mountable. In this manner, reduced package footprint, improved surge current capability, and higher performance may be achieved compared to conventional wire bonded packages. Furthermore, since a low cost printed circuit board (PCB) may be utilized for the package support surface, expensive leadless fabrication processes may be avoided for cost effective manufacturing.

The present application claims the benefit of and priority to a pendingprovisional application entitled “High Voltage Cascaded GaN RectifierLeadless Packages,” Ser. No. 61/482,314 filed on May 4, 2011. Thedisclosure in that pending provisional application is herebyincorporated fully by reference into the present application.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to semiconductor devices. Moreparticularly, the present invention relates to packaging ofsemiconductor devices.

2. Background Art

For high power and high performance circuit applications, III-nitridetransistors such as gallium nitride (GaN) field effect transistors(FETs) are often desirable for their high efficiency and high voltageoperation. In particular, it is often desirable to combine suchIII-nitride transistors with other devices, such as silicon diodes, tocreate high performance rectifiers such as cascoded rectifiers.

Unfortunately, conventional package integration techniques for combiningIII-nitride transistors with silicon diodes often negate the benefitsprovided by such III-nitride transistors. For example, conventionalpackage designs may require wire bonds to leads for terminalconnections, undesirably increasing package form factor, manufacturingcosts, parasitic inductance, resistance, and thermal dissipationrequirements of the package. While quad flat no leads (QFN) packages areknown to avoid wire bonds, such packages may undesirably require highcost fabrication facilities.

Thus, a unique cost-effective solution is needed to support the costeffective fabrication of packages integrating high voltage cascodedIII-nitride rectifiers.

SUMMARY OF THE INVENTION

A high voltage cascoded III-nitride rectifier package utilizing clips ona package support surface, substantially as shown in and/or described inconnection with at least one of the figures, and as set forth morecompletely in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a circuit diagram of a III-nitride transistor coupledwith a Group IV diode.

FIG. 2A illustrates a front side of a group IV diode.

FIG. 2B illustrates a backside of a group IV diode.

FIG. 2C illustrates a front side of a III-nitride transistor.

FIG. 2D illustrates a backside of a III-nitride transistor.

FIG. 2E illustrates a top view of a high voltage cascoded III-nitriderectifier package assembly, according to an embodiment of the invention.

FIG. 2F illustrates a cross sectional view of a high voltage cascadedIII-nitride rectifier package assembly, according to an embodiment ofthe invention.

FIG. 2G illustrates a top view of a high voltage cascoded III-nitriderectifier package assembly, according to an embodiment of the invention.

FIG. 2H illustrates a cross sectional view of a high voltage cascodedIII-nitride rectifier package assembly, according to an embodiment ofthe invention.

FIG. 2I illustrates a top view of a high voltage cascoded III-nitriderectifier package assembly, according to an embodiment of the invention.

FIG. 2J illustrates a cross sectional view of a high voltage cascodedIII-nitride rectifier package assembly, according to an embodiment ofthe invention.

FIG. 2K illustrates a cross sectional view of a high voltage cascodedIII-nitride rectifier package assembly, according to an embodiment ofthe invention.

FIG. 2L illustrates a cross sectional view of a high voltage cascodedIII-nitride rectifier package assembly, according to an embodiment ofthe invention.

FIG. 3 illustrates a cross sectional view of a high voltage cascodedIII-nitride rectifier package mounted to a system printed circuit board(PCB), according to an embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

The present application is directed to a high voltage cascodedIII-nitride rectifier package utilizing clips on a package supportsurface. The following description contains specific informationpertaining to the implementation of the present invention. One skilledin the art will recognize that the present invention may be implementedin a manner different from that specifically discussed in the presentapplication. Moreover, some of the specific details of the invention arenot discussed in order not to obscure the invention. The specificdetails not described in the present application are within theknowledge of a person of ordinary skill in the art.

The drawings in the present application and their accompanying detaileddescription are directed to merely exemplary embodiments of theinvention. To maintain brevity, other embodiments of the invention,which use the principles of the present invention, are not specificallydescribed in the present application and are not specificallyillustrated by the present drawings.

As used herein, the phrase “III-Nitride or III-N” refers to a compoundsemiconductor that includes nitrogen and at least one group threeelement including Al, Ga, In and B, and including but not limited to anyof its alloys, such as aluminum gallium nitride (AlxGa(1-x)N), indiumgallium nitride (InyGa(1-y)N), aluminum indium gallium nitride(AlxInyGa(1-x-y)N), gallium arsenide phosphide nitride (GaAsaPbN(1-a-b)), aluminum indium gallium arsenide phosphide nitride(AlxInyGa(1-x-y)AsaPb N(1-a-b)), amongst others. III-nitride materialalso refers generally to any polarity including but not limited toGa-polar, N-polar, semi-polar or non-polar crystal orientations. TheIII-Nitride material also includes either the Wurtzitic, Zincblende ormixed polytypes, and includes single-crystal, monocrystal, polycrystalor amorphous crystal structures.

Also as used herein, the phrase “Group IV” refers to a semiconductorthat includes at least one group four element including Si, Ge and C,and also includes compound semiconductors SiGe and SiC amongst others.Group IV also refers to semiconductor material which consists of layersof Group IV elements or doping of group IV elements to produce strainedsilicon or strained Group IV material, and also includes Group IV basedcomposite substrates including SOI, SIMOX and SOS (silicon on sapphire),amongst others.

U.S. patent application titled “III-Nitride Transistor Stacked withDiode in a Package,” Ser. No. 13/053,646 filed on Mar. 22, 2011, whosedisclosure is hereby incorporated fully by reference into the presentapplication, teaches a two-terminal stacked-die package including adiode, such as a silicon diode, stacked atop a III-nitride transistor,such that a cathode of the diode resides on and is electrically coupledto a source of the III-nitride transistor. A first terminal of thepackage is coupled to a drain of the III-nitride transistor, and asecond terminal of the package is coupled to an anode of the diode.

The present application addresses and discloses modifications needed toform a wire-bondless surface mountable high voltage semiconductorpackage for use in high voltage (200V-1200V or higher) applications.Additionally, the present application addresses and discloses theconstruction of such a package by describing the use of surfacemountable conductive clips attached to a package support surface.

The present application describes the physical arrangement of astacked-die wire-bondless surface mountable high voltage package. Inparticular, a Group IV diode is stacked atop a III-N material transistorin a quad flat no-lead (QFN) package. Modifications required toaccommodate the high voltage field differential between the anode andcathode of the device (>200V) include widening the physical separationbetween the anode and cathode to, for example, 2.7500 mm or greater.

FIG. 1 illustrates a circuit diagram of a III-nitride transistor coupledwith a Group IV diode, such as a silicon diode. In the presentapplication, references to a “silicon diode” are made for brevity andconvenience only. However, the “Group IV or silicon diode” in thecontext of the present invention's stacked-die package can be replacedwith a non-silicon diode or in general with any diode. FIG. 1 includesterminals 112 a and 112 b, nodes 114 and 116, diode 120, and III-nitridetransistor 130. III-nitride transistor 130 may, for example, comprise agallium nitride (GaN) field effect transistor (FET), or a GaN highelectron mobility transistor (HEMT), and may more specifically comprisea depletion-mode GaN transistor. Diode 120 can be either a PN junctiondiode or a Schottky diode.

In the example shown in FIG. 1, the cathode 121 of diode 120 is coupledto the source 133 of III-nitride transistor 130 at node 114.Additionally, a complete cascoded switch is formed by coupling the gate131 of III-nitride transistor 130 to the anode 122 of diode 120 at node116. Thus, the circuit of FIG. 1 implements a high performance cascodedrectifier. However, in alternative embodiments, the circuit may comprisea different configuration of diode 120 with III-nitride transistor 130.

It may be preferable to form the III-Nitride FET or III-Nitride HEMT asdiscussed in U.S. Pat. No. 7,745,849 issued on Jun. 29, 2010 titled“Enhancement Mode III-Nitride Semiconductor Device with Reduced ElectricField Between the Gate and the Drain,” U.S. Pat. No. 7,759,699 issued onJul. 20, 2010 titled “III-Nitride Enhancement Mode Devices,” U.S. Pat.No. 7,382,001 issued on Jun. 3, 2008 titled “Enhancement ModeIII-Nitride FET,” U.S. Pat. No. 7,112,830 issued on Sep. 26, 2006 titled“Super Lattice Modification of Overlying Transistor,” U.S. Pat. No.7,456,442 issued on Nov. 25, 2008 titled “Super Lattice Modification ofOverlying Transistor,” U.S. Pat. No. 7,339,205 issued on Mar. 4, 2008titled “Gallium Nitride Materials and Methods Associated with the Same,”U.S. Pat. No. 6,849,882 issued on Feb. 1, 2005 titled “Group-III NitrideBased High Electron Mobility Transistor (HEMT) with Barrier/SpacerLayer,” U.S. Pat. No. 6,617,060 issued on Sep. 9, 2003 titled “GalliumNitride Materials and Methods,” U.S. Pat. No. 6,649,287 issued on Nov.18, 2003 titled “Gallium Nitride Materials and Methods,” U.S. Pat. No.5,192,987 issued on Mar. 9, 1993 titled “High Electron MobilityTransistor with GAN/ALXGA1-XN Heterojunctions,” and U.S. patentapplication titled “Group III-V Semiconductor Device withStrain-Relieving Interlayers,” Ser. No. 12/587,964 filed on Oct. 14,2009, U.S. patent application titled “Stress Modulated Group III-VSemiconductor Device and Related Method,” Ser. No. 12/928,946 filed onDec. 21, 2010, U.S. patent application titled “Process for Manufactureof Super Lattice Using Alternating High and Low Temperature Layers toBlock Parasitic Current Path,” Ser. No. 11/531,508 filed on Sep. 13,2006, U.S. patent application titled “Programmable III-NitrideTransistor with Aluminum-Doped Gate,” Ser. No. 13/021,437 filed on Feb.4, 2011, U.S. patent application titled “Enhancement Mode III-NitrideTransistors with Single Gate Dielectric Structure,” Ser. No. 13/017,970filed on Jan. 31, 2011, U.S. patent application titled “Gated AlGaN/GaNHeterojunction Schottky Device,” Ser. No. 12/653,097 filed on Dec. 7,2009, U.S. patent application titled “Enhancement Mode III-NitrideDevice with Floating Gate and Process for Its Manufacture,” Ser. No.12/195,801 filed on Aug. 21, 2008, U.S. patent application titled“III-Nitride Semiconductor Device with Reduced Electric Field BetweenGate and Drain and Process for Its Manufacture,” Ser. No. 12/211,120filed on Sep. 16, 2008, U.S. patent application titled “III-NitridePower Semiconductor Device Having a Programmable Gate,” Ser. No.11/857,113 filed on Sep. 8, 2007, U.S. provisional patent applicationtitled “III-Nitride Heterojunction Devices, HEMTs and Related DeviceStructures,” Ser. No. 61/447,479 filed on Feb. 28, 2011, and U.S.provisional patent application titled “III-Nitride Material InterlayerStructures,” Ser. No. 61/449,046 filed on Mar. 3, 2011, which are allhereby incorporated fully into the present application by reference. Itmay also be desirable that the III-Nitride FET be a high voltage III-NFET. III-N FET 130 may be optimized to operate with a V_(drain) ofbetween 200V-5000V, or it may be preferred that FET 130 be optimized tooperate between 500V-700V or any other sub range between 200V-5000V.

Turning to FIGS. 2A-2D, FIG. 2A illustrates a front side of a group IVdiode, FIG. 2B illustrates a backside of a group IV diode, FIG. 2Cillustrates a front side of a III-nitride transistor, and FIG. 2Dillustrates a backside of a III-nitride transistor. With respect toFIGS. 2A-2D, diode 220 may correspond to diode 120 from FIG. 1, andIII-nitride transistor 230 may correspond to III-nitride transistor 130from FIG. 1. In certain embodiments, a die size of approximately 1 mm×1mm may be preferred for diode 220. In certain other embodiments, the diesize of diode 220 may be larger or smaller. As shown in FIGS. 2A and 2B,the silicon diode 220 includes an anode 222 on a top surface and acathode 212 on an opposite bottom surface. As shown in FIGS. 2C and 2D,the III-nitride transistor 230 includes a gate 231, a drain 232, and asource 233 on a top surface, whereas a bottom or backside surface isinactive. In certain embodiments, a die size of approximately 3.2mm×2.795 mm may be preferred for III-nitride transistor 230. In certainother embodiments, the die size of III-nitride transistor 230 may belarger or smaller.

Next, FIGS. 2E, 2G, and 2I illustrate top views of a high voltagecascoded III-nitride rectifier package assembly, according to anembodiment of the invention. FIGS. 2F, 2H, 2J, 2K, and 2L alsoillustrate corresponding cross sectional views of a high voltagecascoded III-nitride rectifier package assembly, according to anembodiment of the invention. FIG. 3 also illustrates a cross sectionalview of a completed high voltage cascoded III-nitride rectifier packagemounted to a system printed circuit board (PCB), according to anembodiment of the invention.

Starting with FIG. 2E, the III-nitride transistor 230 of FIGS. 2C-2D isattached to package support surface 260, for example by a die attachmaterial. Package support surface 260 may comprise, for example, asingle, dual, or multi layer printed circuit board (PCB). However,alternative embodiments may utilize other support surfaces, such as aceramic substrate. Package support surface 260 may be approximately 125microns thick, but any thickness may be selected to provide appropriatestiffness for conductive clips to be connected during assembly. Incertain embodiments, package support surface 260 may also includethermal traces for improved heat dissipation. As shown in FIG. 2E, thebackside 240 of III-nitride transistor 230 is coupled to package supportsurface 260 such that gate 231, drain 232, and source 233 are accessibleon a top surface. FIG. 2F also illustrates a cross sectional viewcorresponding to line 2F-2F in FIG. 2E.

For simplicity, the Figures may only illustrate the assembly of a singlepackage. However, it is understood that package support surface 260 mayaccommodate multiple packages, for example in a strip or grid, which arelater singulated into individual packages. Thus, multiple packages maybe processed at the same time.

From FIG. 2E to FIG. 20, diode 220 is stacked atop III-nitridetransistor 230 such that the cathode 221 (not visible) resides on source233. As a result, the anode 222 is accessible on a top surface of diode220. Prior to such stacking, solder, such as a solder paste or a solderpre-form, may be applied to gate 231, drain 232, and source 233.Alternatively, other materials such as conductive adhesive or conductivetape may substitute for solder. FIG. 2H also illustrates a crosssectional view corresponding to line 2H-2H in FIG. 2G.

From FIG. 2G to FIG. 2I, conductive clips 212 a and 212 b may be pickedand placed on top of package 210, as shown. Thus, a first conductiveclip 212 b is connected to anode 222 of diode 220 and gate 231 ofIII-nitride transistor 230, and a second conductive clip 212 a isconnected to drain 232 of III-nitride transistor 230. Conductive clips212 a and 212 b may comprise, for example, copper or copper alloys.Prior to such placing, additional solder may be deposited on top ofanode 222 of diode 220 and on top of package support surface 260. Asshown in FIGS. 2J and 2K, conductive clips 212 a and 212 b are furtherconnected to package support surface 260 for mechanical support.Further, conductive clips 212 a and 212 b each have a respective flatportion 214 a and 214 b, suitable for surface mounting. The flatportions 214 a and 214 b may also be substantially coplanar to furtherfacilitate surface mounting of package 210.

The ends of conductive clips 212 a and 212 b connect to mating surfacesusing straight connections, as shown in FIGS. 2J and 2K. For example,conductive clip 212 b is connected to anode 222 of diode 220 by astraight connection, as shown in FIG. 2J. However, alternativeembodiments may use various other connections including a screw-head, anail-head, a mushroom connector, or a coin connector, depending onapplication requirements for mating surface area, mechanical stability,and ease of manufacture.

After picking and placing conductive clips 212 a and 212 b, the entireassembly may be heated, for example in a reflow or conveyor oven, toreflow the previously deposited solder. As a result, cathode 221 ofdiode 220 may be electrically and mechanically coupled to source 233 ofIII-nitride transistor 230, conductive clip 212 b may be connected togate 231 of III-nitride transistor 230 and anode 222 of diode 220, andconductive clip 212 a may be connected to drain 232 of III-nitridetransistor 230. Further, conductive clips 212 a and 212 b may each beconnected to package support surface 260, which provides mechanicalsupport and thermal dissipation for package 210. Thus, the cascodedrectifier circuit illustrated in diagram 100 of FIG. 1 is provided, withconductive clip 212 a corresponding to terminal 112 a of FIG. 1 andconductive clip 212 b corresponding to terminal 112 b of FIG. 1.

From FIG. 2K to FIG. 2L, an encapsulant such as glob-top 265 mayoptionally be applied to package 210, providing insulation andprotection for III-nitride transistor 230 and diode 220. In certainother embodiments, other encapsulants may be preferred, and theencapsulant may extend beyond the top edges of the stacked die assemblyof III-nitride transistor 230 and diode 220.

From FIG. 2L to FIG. 3, package 210 may be singulated and flipped ontosystem printed circuit board (PCB) 310, using conventional methods asknown in the art. A distance of at least 2.7500 mm, for example 3.0000mm, may be provided between flat portions 214 a and 214 b mounted onsystem PCB 310, enabling high voltage operation at 600V. It should benoted that only a portion of system PCB 310 is shown for simplicity, aspackage 210 may be integrated as part of a larger circuit on system PCB310.

Thus, a high voltage cascoded III-nitride rectifier package utilizingclips on a package support surface and methods for fabricating such apackage have been described. The disclosed package provides a highvoltage III-nitride cascoded rectifier in a compact package withoutusing wire bonds. As a result, reduced package footprint, improved surgecurrent capability, and higher performance may be achieved compared toconventional wire bonded packages. Since the package may utilize lowcost package support surfaces such as single layer PCBs, expensiveleadless package fabrication processes may be advantageously avoided,and available surface mount technology (SMT) manufacturing facilitiesmay be utilized. Furthermore, since multiple packages may be assembledat a time, high integration and cost savings may be achieved compared toconventional methods requiring individual package processing.

From the above description of the invention it is manifest that varioustechniques can be used for implementing the concepts of the presentinvention without departing from its scope. Moreover, while theinvention has been described with specific reference to certainembodiments, a person of ordinary skills in the art would recognize thatchanges can be made in form and detail without departing from the spiritand the scope of the invention. As such, the described embodiments areto be considered in all respects as illustrative and not restrictive. Itshould also be understood that the invention is not limited to theparticular embodiments described herein, but is capable of manyrearrangements, modifications, and substitutions without departing fromthe scope of the invention.

1-11. (canceled)
 12. A method for manufacturing a wire-bondless surfacemountable high voltage semiconductor package, said method comprising:attaching, to a package support surface, a III-nitride transistor havinga gate, a source, and a drain; stacking over said source of saidIII-nitride transistor a diode having a cathode and an anode; connectinga first conductive clip to said gate of said III-nitride transistor,said anode of said diode, and said package support surface; connecting asecond conductive clip to said drain of said III-nitride transistor andsaid package support surface; said first conductive clip and secondconductive clip each having respective flat portions for surfacemounting said high voltage semiconductor package.
 13. The method ofclaim 12, wherein said respective flat portions are substantiallycoplanar.
 14. The method of claim 12, further comprising encapsulatingsaid III-nitride transistor and said diode with a glob-top.
 15. Themethod of claim 12, wherein said first and second conductive clipscomprise copper.
 16. The method of claim 12, wherein said packagesupport surface comprises a printed circuit board (PCB).
 17. The methodof claim 16, wherein said package support surface includes thermaltraces.
 18. The method of claim 12, wherein said connecting said firstconductive clip to said anode of said diode is by a connector selectedfrom the group consisting of a coin connector, a mushroom connector, anail-head, a screw-head, and a straight connector.
 19. The method ofclaim 12, wherein said diode is a Schottky diode.
 20. The method ofclaim 12, wherein said III-nitride transistor is a GaN FET.
 21. A methodfor manufacturing a wire-bondless surface mountable high voltagesemiconductor package, said method comprising: attaching, to a packagesupport surface, a III-nitride transistor having a gate, a source, and adrain; stacking over said source of said III-nitride transistor a diodehaving a cathode and an anode; connecting a first conductive clip tosaid gate of said III-nitride transistor, said anode of said diode, andsaid package support surface.
 22. The method of claim 21, furthercomprising connecting a second conductive clip to said drain of saidIII-nitride transistor and said package support surface.
 23. The methodof claim 21, wherein said first conductive clip has a flat portion forsurface mounting said high voltage semiconductor package.
 24. The methodof claim 22, wherein said second conductive clip has a flat portion forsurface mounting said high voltage semiconductor package.
 25. The methodof claim 22, wherein said first conductive clip and second conductiveclip each has respective flat portions for surface mounting said highvoltage semiconductor package.
 26. The method of claim 25, wherein saidrespective flat portions are substantially coplanar.
 27. The method ofclaim 21, further comprising encapsulating said III-nitride transistorand said diode with a glob-top.
 28. The method of claim 22, wherein saidfirst and second conductive clips comprise copper.
 29. The method ofclaim 21, wherein said connecting said first conductive clip to saidanode of said diode is by a connector selected from the group consistingof a coin connector, a mushroom connector, a nail-head, a screw-head,and a straight connector.
 30. The method of claim 21, wherein said diodeis a Schottky diode.
 31. The method of claim 21, wherein saidIII-nitride transistor is a GaN FET.